Umgangatho oPhezulu wePhenolic Epoxy Resin CAS 61788-97-4 ngexabiso elihle

Intshayelelo yemveliso

MF: C21H23ClFNO2
MW: 375.8642232
CAS: 61788-97-4

amagqabantshintshi

Ikhompawundi ye-polymer equlethe iqela le-epoxy kwisakhiwo se-molecular ibizwa ngokuba yi-epoxy resin.I-epoxy resin enyangisiweyo ineempawu ezilungileyo zomzimba kunye neekhemikhali, kumphezulu wesinyithi kunye nezinto ezingezona zentsimbi zinamandla okudibanisa, iipropati ezilungileyo ze-dielectric, ukubeka i-shrinkage encinci, imveliso yokomisa i-dimensional stability, ukuqina okuphezulu, ukuguquguquka okulungileyo, ukunyibilika kwe-alkali kunye neyona nto izinzileyo. , kwaye ngoko isetyenziswa ngokubanzi ekukhuseleni kwesizwe, amasebe oqoqosho lwesizwe, Ukuphosa, ukufakelwa, i-laminate, i-adhesive, i-coating kunye nezinye izicelo.Kwilizwe lethu ukusukela ngo-1958 evulekileyo iChemicalbook epoxy resin yafundwa, kwaye ngesantya esikhawulezayo kwimveliso yeshishini, iye yanda kwihlabathi liphela, ukongeza kwimveliso eqhelekileyo - i-bisphenol A epoxy chlororopane uhlobo lwe-epoxy resin, yimveliso. yeentlobo ezahlukeneyo zohlobo olutsha lwe-epoxy resin, ukuze kuhlangatyezwane nemfuno yelizwe lolwakhiwo lwesizwe lokhuselo kunye namasebe ezoqoqosho.Iintlaka ze-epoxy zinokulungiswa ngezi ndlela zilandelayo: ukusabela kweehydrides ezisebenzayo kunye ne-epichlorohydrin, i-oxidation yesigaba solwelo se-double bond nge-hydrogen peroxide okanye i-peracetic acid, kunye ne-air oxidation ye-double bond compound.

Injongo kunye nomsebenzi

I-epoxy resin isetyenziswa ngokubanzi njenge-adhesive, anti-corrosive material, insulating insulating, laminating material, casting and impregnating material, izinto zokubumba, njl njl. arhente yokugqiba.Ngokubhekiselele kwi-coating, isetyenziswa kakhulu njengentsimbi yokukhusela iinqanawa, isinyithi kunye namacandelo ensimbi, izitya zetsimbi, njl. Ukongeza, njenge-cationic electrophoretic coating carrier, isetyenziswa ngokubanzi kwi-coating ephantsi yomzimba wemoto.I-Chemicalbook isetyenziswa ngokubanzi njengepeyinti yokukhusela, i-injection yokubumba izinto, izinto zokubumba, ngokukodwa kwi-electronic industry, ngaphezu kwebhodi elaminethiweyo, esetyenziswa ngokubanzi njenge-LSI, i-IC kunye nezinye izinto zokutywina;Kulwakhiwo loluntu, isetyenziswa njengempahla engatyibilikiyo, izinto zomgangatho kunye nezinto zodaka kwindlela yokuphosa ikhonkrithi;Njengoko i-adhesive, kunye ne-adhesion efanelekileyo isetyenziswe ngokubanzi kwintsimbi kunye nezinto ezingezizo zetsimbi (ezifana neekeramics, iglasi, iinkuni, njl.) Ukudibanisa;Ikwasetyenziswa njenge-resin, i-PVC stabilizer;I-Textile primer ukukhusela i-crease kunye ne-shrinkage.

iiparamitha

Iimpawu zemichiza kunye nezomzimba
Ubuninzi : 1.2±0.1 g/cc
Indawo yokubilisa: 529.0±50.0 ° C kwi-760 mm Hg
Indawo edanyazayo 273.8±30.1 degrees Celsius
Ubunzima obuchanekileyo 375.140137
PSA 40.54
I-oyile kunye ne-coefficient yokuhanjiswa kwamanzi : 3.01
Uxinzelelo lomphunga: 0.0±1.5 mm hg kuma-25 ° C
Isalathiso se-refractive: 1.581
Umbala: mthubi
Ubomi beShelf: iminyaka emi-2
Ubunyulu: 99%